There are several driving forces for 3D integration. The potential benefits include higher performance, reduced power requirement, smaller size and eventually lower cost than conventional 2D packaging. Some of the basic driving forces for 3D integration are
There have been several 3D integration techniques and associated challenges presented in the Wafer Level Packaging and System-in-a-Package fields. The issues specifically related to Through Silicon Via (TSV) are presented in tables derived from The International Technology Roadmap for Semiconductors.
There have been several 3D integration techniques and associated challenges presented in the Wafer Level Packaging and System-in-a-Package fields. The issues specifically related to Through Silicon Via (TSV) are presented in tables derived from The International Technology Roadmap for Semiconductors.
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