IC packaging report covers 12 package types + bare die, SATS providers - Advanced Packaging

New Venture Research will release "The Worldwide IC Packaging Market, 2011 Edition" in May 2011. It offers an in-depth look at the worldwide integrated circuit (IC) packaging market.

The forecasts of individual IC device markets are provided, for units, revenue, and ASP, from 2008 through 2014.

The packages for each of these markets are then forecast, broken down into I/O ranges.

In a separate chapter, the package types are rolled up to deliver an overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions. The major package families include:

* Dual in-line package (DIP);

* Small outline transistor (SOT);

* Small outline (SO);

* Thin small outline package (TSOP);

* Dual flat pack no lead (DFN);

* Chip carrier (CC);

* Quad flat pack (QFP);

* Quad flat pack no lead (QFN);

* Pin grid array (PGA);

* Ball grid array (BGA);

* Fine-pitched ball grid array (FBGA);

* Wafer-level package (WLP).


Additional unit forecasts cover die-mounting using direct chip attach (DCA) methods:

* Chip on board (COB);
* Flip chip on board (FCOB);
* Chip on glass (COG);
* Flip chip on glass (FCOG);
* And tape automated bonding (TAB)/tape carrier package (TCP).
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