The recent IMAPS Global Business Council (GBC) Meeting and Device Packaging Conference (DPC) was the source of some significant new developments in the areas of 3D IC and fan-out wafer-level packaging.
Micro-chip fabrication and packaging enthusiast
contact email :
Chaudhary(dot)Aakarsh(at)gmail.com
Hey guys at Intel and Amkor, how about hiring me haan ?
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