The panel assembled to discuss ongoing developments in 3D MEMS integration brought together expertise in MEMS system design (Carolyn White, of Fitzgerald and Associates), MEMS assembly and packaging (Lee Smith, Amkor) MEMS R&D (Nicolas Sillon, Leti) and processes and equipment (Bioh Kim, EV Group.) As such, we touched on everything from processes being used in volume manufacturing today, process showing promise in development, limitations that are being addressed, and those that still need work.
3D MEMS Update | 3D InCites
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