Not only are today’s package designers and assemblers faced with the inherent design and functionality challenges associated with smaller device footprints and higher I/O counts, but they must also ensure that proper thermal control is built into advanced electronics packages. In fact, heat management for modern power semiconductor devices such as rectifiers, power transistors, amplifiers and countless other consumer and automotive applications is one of the most pressing issues facing the packaging industry. As these packages marry smaller outlines with higher functions, ensuring efficient thermal management will be key to long-term reliability and performance.
Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements
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