The TSV investment is the addition of a 300mm "mid-end" process flow that occurs between the wafer fabrication and back-end assembly process. Mid-end processes support the advanced manufacturing requirements of 2.5D and 3D TSV as well as wafer-level packaging (WLP), flip chip, and embedded die technology.
Thursday, April 21, 2011
STATS ChipPAC expands TSV service with mid-end flow - Advanced Packaging
STATS ChipPAC Ltd. (SGX-ST: STATSChP), semiconductor test and advanced packaging service provider, is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities.
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